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Mighty Mo 10 Racks
January 19,2012

Ortronics Brings Thermal Management to Cisco Live London

NEW LONDON, Conn., January 19, 2011 – Ortronics, a Group brand Legrand, the global leader in high performance network infrastructure solutions, will be a Gold Sponsor of Cisco Live, taking place January 31-February 2 at the ICC London ExCel. Attendees at Cisco Live can visit Ortronics in stand G9 to learn how Ortronics Mighty Mo solutions help reduce energy costs.
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Clarity 6A Jacks
September 27,2011

Legrand | Ortronics Introduces Clarity 6A Solutions

Supporting performance above the standards

NEW LONDON, Conn., September 27, 2011 — Legrand | Ortronics, a global leader in high performance network infrastructure solutions, is proud to introduce new Clarity 6A advanced solutions. Clarity 6A connectivity more effectively supports the internal and alien performance requirements of 10 Gigabit Ethernet.
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August 16,2011

Ortronics Achieves Copper and Fiber Channel Certification in Italy

NEW LONDON, Conn., August 16, 2011 – Ortronics, a Group brand Legrand, the global leader in high performance network infrastructure solutions, has achieved channel certification by the Institute of Communications and Information Technology (ISCTI), a part of the Ministry of Economic Development – Communications in Italy. ISCTI/ISCOM acts as a technical body and third party, with a focus on standardization, testing and education, ensuring greater transparency and access to services for users, manufacturers and operators of telecommunications networks.

July 19,2011

Legrand | Ortronics continues to be a corporate leader of sustainability with eco-friendly packaging and product innovations

NEW LONDON, Conn., July 19, 2011 – Legrand | Ortronics, a global leader in high performance network infrastructure solutions, is proud to introduce new environmentally friendly packaging and product innovations. Legrand | Ortronics continues their commitment to sustainable business practices as part of their corporate strategy, setting an example of best practices for environmentally responsible corporate behavior.

October 12,2011

Legrand | Ortronics Introduces Tool Less Filler Panels

A square peg for a round hole

NEW LONDON, Conn., April 26, 2011 – Legrand | Ortronics, a global leader in high performance network infrastructure solutions, introduces Tool Less Snap In Filler Panels. The patent pending tool less filler panel is designed to snap into 19” EIA tapped holes or square holes in the mounting rail. Because the design does not require field modification, the panel can be remounted across different mounting rails - eliminating the need to stock two different types of panels.